TI WiLink 7.0 is another multi-purpose device that has virtually squeezed the current latest wireless technologies into a single chip. This chip will allow manufacturer to save more space in cell phone electronic board and allow more upcoming mobile phone features to be added.
TI WiLink 7.0 Chipset is practically 50% smaller than the current chipsets (from other brand) that offers similar functionality. Beside it is smaller, it also use 30% less power. This could be resulting in a longer battery life for the mobile phone, and it should have a better wireless connection option for the upcoming cell phone with TI WiLink 7.0 chipset implemented.
[via SlashGear]
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